The Division of Microelectronic Interconnect Materials is one of the eight research divisions in the Shenyang National Laboratory for Materials Science. The Division was conceived in August 2002 to meet the growing needs of emerging microelectronic industry in China. The initial focus of the Division was the Pb-free solder alloys for chip attachment to the board and for joining of chip carriers with the PCB. Those alloys are widely used in two leading high density interconnect technologies, namely flip chip or C4 and ball grid array (BGA) interconnect structures (Figure). These alloys had to be Pb-free to meet the European Union’s regulation of hazardous materials in electronic products, which took effect in July 2007, and to address the environmental concerns over use of the Pb-bearing solders. Subsequently the Division has expanded the research topics to including wettable surfaces and materials, thermal interface materials, semiconductor oxides, and in-situ transmission electron microscopy observations of electronic materials.